Kjøpe SN75LVDS9637DR med BYCHPS
Kjøp med garanti
SN75LVDS9637DR
- Delenummer:
- SN75LVDS9637DR
- Produsent:
- Beskrivelse:
- IC DIFF RCVR DUAL HS 8-SOIC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15834 Pieces
- Dataark:
- SN75LVDS9637DR.pdf
Introduksjon
BYCHIPS er strømprodusenten for SN75LVDS9637DR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SN75LVDS9637DR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Type: | Receiver |
| Leverandør Enhetspakke: | 8-SOIC |
| Serie: | - |
| protokoll: | LVDS |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 8-SOIC (0.154", 3.90mm Width) |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall drivere / mottakere: | 0/2 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | SN75LVDS9637DR |
| Utvidet beskrivelse: | 0/2 Receiver LVDS 8-SOIC |
| duplex: | - |
| Beskrivelse: | IC DIFF RCVR DUAL HS 8-SOIC |
| Datahastighet: | 155Mbps |
| Email: | [email protected] |
Beslektede deler til SN75LVDS9637DR
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
|
SN75LVDS9638D | Texas Instruments | IC DIFF DRVR DUAL HS 8-SOIC | Forespørsel |
|
SN75LVDS9638DGK | Texas Instruments | IC DIFF RCVR DUAL HS 8VSSOP | Forespørsel |
|
SN75LVDS9638DGKR | Texas Instruments | IC DIFF RCVR DUAL HS 8VSSOP | Forespørsel |
|
SN75LVDS9637D | Texas Instruments | IC DIFF RCVR DUAL HS 8-SOIC | Forespørsel |
|
SN75LVDS9637DRG4 | Texas Instruments | IC DIFF RCVR DUAL HS 8-SOIC | Forespørsel |
|
SN75LVDS9638DGKRG4 | Texas Instruments | IC DIFF RCVR DUAL HS 8VSSOP | Forespørsel |
|
SN75LVDS9638DRG4 | Texas Instruments | IC DIFF RCVR DUAL HS 8-SOIC | Forespørsel |
|
SN75LVDS9638DR | Texas Instruments | IC DIFF RCVR DUAL HS 8-SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers