Kjøpe SSC7102-GQ-AA0-TR med BYCHPS
Kjøp med garanti
SSC7102-GQ-AA0-TR
- Delenummer:
- SSC7102-GQ-AA0-TR
- Produsent:
- Micrel / Microchip Technology
- Beskrivelse:
- IC SENSOR FUSION HUB 84TFBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14995 Pieces
Introduksjon
BYCHIPS er strømprodusenten for SSC7102-GQ-AA0-TR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SSC7102-GQ-AA0-TR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Hub |
|---|---|
| Leverandør Enhetspakke: | 84-TFBGA (6x6) |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 84-TFBGA |
| Utgangstype: | - |
| Driftstemperatur: | - |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | SSC7102-GQ-AA0-TR |
| Interface: | I²C |
| Inngangstype: | - |
| Beskrivelse: | IC SENSOR FUSION HUB 84TFBGA |
| Strøm - Forsyning: | - |
| Email: | [email protected] |
Beslektede deler til SSC7102-GQ-AA0-TR
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SSC7102-GQ-AA0 | Microchip Technology | IC SENSOR FUSION HUB 84TFBGA | Forespørsel |
|
SSC7102-GQ-BA0 | Microchip Technology | IC SENSOR FUSION MOVEA 84TFBGA | Forespørsel |
|
SSC7102-GQ-BA0-TR | Microchip Technology | IC SENSOR FUSION MOVEA 84TFBGA | Forespørsel |
|
SSC7102-GQ-AB2-TR | Microchip Technology | IC SENSOR HUB LPC 84TFBGA | Forespørsel |
|
SSC7102-GQ-AB2 | Microchip Technology | SENSOR FUSION HUB | Forespørsel |
 |
MCP9600-E/MX | Microchip Technology | IC THERMOCOUPLE TO I2C 20MQFN | Forespørsel |
 |
SSC7150-ML-AB0 | Microchip Technology | IC SENSOR FUSION HUB 28QFN | Forespørsel |
 |
XTR116UA/2K5 | Texas Instruments | IC 4 TO 20MA TRANSMITTER 8-SOIC | Forespørsel |
 |
MAX35101EHJ+ | Maxim Integrated | IC TIME-TO-DGTL CONV W/AFE TQFP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers