Kjøpe SSTUG32866EC/S,518 med BYCHPS
Kjøp med garanti
SSTUG32866EC/S,518
- Delenummer:
- SSTUG32866EC/S,518
- Produsent:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC BUFFER 1.8V 25BIT 96-LFBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15110 Pieces
- Dataark:
- SSTUG32866EC/S,518.pdf
Introduksjon
BYCHIPS er strømprodusenten for SSTUG32866EC/S,518, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SSTUG32866EC/S,518 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Forsyningsspenningen: | 1.7 V ~ 2 V |
|---|---|
| Leverandør Enhetspakke: | 96-LFBGA (13.5x5.5) |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 96-LFBGA |
| Andre navn: | 935284581518 SSTUG32866EC/S-T SSTUG32866EC/S-T-ND |
| Driftstemperatur: | 0°C ~ 85°C |
| Antall bit: | 25, 14 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | SSTUG32866EC/S,518 |
| Logikk Type: | 1:1, 1:2 Configurable Registered Buffer with Parity |
| Utvidet beskrivelse: | 1:1, 1:2 Configurable Registered Buffer with Parity IC 96-LFBGA (13.5x5.5) |
| Beskrivelse: | IC BUFFER 1.8V 25BIT 96-LFBGA |
| Email: | [email protected] |
Beslektede deler til SSTUG32866EC/S,518
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SSTUG32865ET/S,518 | NXP USA Inc. | IC BUFFER 1.8V 28BIT 160-TFBGA | Forespørsel |
|
SSTUG32865ET/G,518 | NXP USA Inc. | IC BUFFER 1.8V 28BIT 160-TFBGA | Forespørsel |
 |
SSTUG32866EC/G,518 | NXP USA Inc. | IC BUFFER 1.8V 25BIT 96-LFBGA | Forespørsel |
 |
SSTUG32868ET/G,518 | NXP USA Inc. | IC BUFFER 1.8V 25BIT 176-LFBGA | Forespørsel |
|
SSTUG32868ET/S,518 | NXP USA Inc. | IC BUFFER 1.8V 25BIT 176-LFBGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers