Kjøpe SSTV16859EC,551 med BYCHPS
Kjøp med garanti
SSTV16859EC,551
- Delenummer:
- SSTV16859EC,551
- Produsent:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC BUFFER DDR 13BIT 96-LFBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17701 Pieces
- Dataark:
- SSTV16859EC,551.pdf
Introduksjon
BYCHIPS er strømprodusenten for SSTV16859EC,551, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SSTV16859EC,551 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Forsyningsspenningen: | 2.3 V ~ 2.7 V |
|---|---|
| Leverandør Enhetspakke: | 96-LFBGA (13.5x5.5) |
| Serie: | 74SSTV |
| emballasje: | Tray |
| Pakke / tilfelle: | 96-LFBGA |
| Andre navn: | 935271265551 SSTV16859EC-S SSTV16859EC-S-ND |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall bit: | 13, 26 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | SSTV16859EC,551 |
| Logikk Type: | Registered Buffer with SSTL_2 Compatible I/O for DDR |
| Utvidet beskrivelse: | Registered Buffer with SSTL_2 Compatible I/O for DDR IC 96-LFBGA (13.5x5.5) |
| Beskrivelse: | IC BUFFER DDR 13BIT 96-LFBGA |
| Email: | [email protected] |
Beslektede deler til SSTV16859EC,551
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers