Kjøpe STFU24N60M2 med BYCHPS
Kjøp med garanti
STFU24N60M2
- Delenummer:
- STFU24N60M2
- Produsent:
- ST
- Beskrivelse:
- MOSFET N-CH 600V 18A TO-220FP
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 16198 Pieces
- Dataark:
- STFU24N60M2.pdf
Introduksjon
BYCHIPS er strømprodusenten for STFU24N60M2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for STFU24N60M2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 4V @ 250µA |
|---|---|
| Vgs (maks): | ±25V |
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Enhetspakke: | TO-220FP |
| Serie: | MDmesh™ M2 |
| Rds På (Maks) @ Id, Vgs: | 190 mOhm @ 9A, 10V |
| Strømdissipasjon (maks): | 30W (Tc) |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-220-3 Full Pack |
| Andre navn: | 497-16110-5 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 22 Weeks |
| Produsentens varenummer: | STFU24N60M2 |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 1060pF @ 100V |
| Gateavgift (Qg) (Maks) @ Vgs: | 29nC @ 10V |
| FET Type: | N-Channel |
| FET-funksjonen: | - |
| Utvidet beskrivelse: | N-Channel 600V 18A (Tc) 30W (Tc) Through Hole TO-220FP |
| Drivspenning (Maks. Rds På, Min Rds På): | 10V |
| Drain til Source Voltage (VDSS): | 600V |
| Beskrivelse: | MOSFET N-CH 600V 18A TO-220FP |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 18A (Tc) |
| Email: | [email protected] |
Beslektede deler til STFU24N60M2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers