Kjøpe STGD5H60DF med BYCHPS
Kjøp med garanti
STGD5H60DF
- Delenummer:
- STGD5H60DF
- Produsent:
- ST
- Beskrivelse:
- TRENCH GATE FIELD-STOP IGBT, H S
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18919 Pieces
- Dataark:
- STGD5H60DF.pdf
Introduksjon
BYCHIPS er strømprodusenten for STGD5H60DF, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for STGD5H60DF via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 1.95V @ 15V, 5A |
| Testtilstand: | 400V, 5A, 47 Ohm, 15V |
| Td (på / av) @ 25 ° C: | 30ns/140ns |
| Bytte energi: | 56µJ (on), 78.5µJ (off) |
| Leverandør Enhetspakke: | DPAK |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 134.5ns |
| Strøm - Maks: | 83W |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Andre navn: | 497-16479-2 |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 26 Weeks |
| Produsentens varenummer: | STGD5H60DF |
| Inngangstype: | Standard |
| IGBT Type: | Trench Field Stop |
| Gate Charge: | 43nC |
| Utvidet beskrivelse: | IGBT Trench Field Stop 600V 10A 83W Surface Mount DPAK |
| Beskrivelse: | TRENCH GATE FIELD-STOP IGBT, H S |
| Nåværende - Samlerpulserte (Icm): | 20A |
| Nåværende - Samler (Ic) (Maks): | 10A |
| Email: | [email protected] |
Beslektede deler til STGD5H60DF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers