Kjøpe STTH12T06DI med BYCHPS
Kjøp med garanti
STTH12T06DI
- Delenummer:
- STTH12T06DI
- Produsent:
- ST
- Beskrivelse:
- DIODE GEN PURP 600V 12A TO220AC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16882 Pieces
- Dataark:
- STTH12T06DI.pdf
Introduksjon
BYCHIPS er strømprodusenten for STTH12T06DI, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for STTH12T06DI via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 2.95V @ 12A |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 600V |
| Leverandør Enhetspakke: | TO-220AC ins |
| Hastighet: | Fast Recovery = 200mA (Io) |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 20ns |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-220-2 Insulated, TO-220AC |
| Andre navn: | 497-13849-5 |
| Driftstemperatur - Kobling: | -40°C ~ 175°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | STTH12T06DI |
| Utvidet beskrivelse: | Diode Standard 600V 12A Through Hole TO-220AC ins |
| Diodetype: | Standard |
| Beskrivelse: | DIODE GEN PURP 600V 12A TO220AC |
| Strøm - Omvendt lekkasje @ Vr: | 20µA @ 600V |
| Gjeldende - Gjennomsnittlig Rectified (Io): | 12A |
| Kapasitans @ Vr, F: | - |
| Email: | [email protected] |
Beslektede deler til STTH12T06DI
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers