Kjøpe STU9N60M2 med BYCHPS
Kjøp med garanti
STU9N60M2
- Delenummer:
- STU9N60M2
- Produsent:
- ST
- Beskrivelse:
- MOSFET N-CH 600V 5.5A IPAK
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12132 Pieces
- Dataark:
- STU9N60M2.pdf
Introduksjon
BYCHIPS er strømprodusenten for STU9N60M2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for STU9N60M2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 4V @ 250µA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Enhetspakke: | IPAK (TO-251) |
| Serie: | MDmesh™ II Plus |
| Rds På (Maks) @ Id, Vgs: | 780 mOhm @ 3A, 10V |
| Strømdissipasjon (maks): | 60W (Tc) |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-251-3 Short Leads, IPak, TO-251AA |
| Andre navn: | 497-13886-5 |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 26 Weeks |
| Produsentens varenummer: | STU9N60M2 |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 320pF @ 100V |
| Gateavgift (Qg) (Maks) @ Vgs: | 10nC @ 10V |
| FET Type: | N-Channel |
| FET-funksjonen: | - |
| Utvidet beskrivelse: | N-Channel 600V 5.5A (Tc) 60W (Tc) Through Hole IPAK (TO-251) |
| Drain til Source Voltage (VDSS): | 600V |
| Beskrivelse: | MOSFET N-CH 600V 5.5A IPAK |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 5.5A (Tc) |
| Email: | [email protected] |
Beslektede deler til STU9N60M2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog