Kjøpe T322E336K035AT med BYCHPS
Kjøp med garanti
T322E336K035AT
- Delenummer:
- T322E336K035AT
- Produsent:
- KEMET
- Beskrivelse:
- CAP TANT 33UF 35V 10% AXIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18665 Pieces
- Dataark:
- T322E336K035AT.pdf
Introduksjon
BYCHIPS er strømprodusenten for T322E336K035AT, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for T322E336K035AT via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 35V |
|---|---|
| Type: | Molded |
| Toleranse: | ±10% |
| Størrelse / Dimensjon: | 0.280" Dia x 0.530" L (7.11mm x 13.46mm) |
| Serie: | T322 |
| emballasje: | Bulk |
| Pakke / tilfelle: | Axial |
| Andre navn: | 399-4608 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsent Størrelse Kode: | E |
| Produsentens varenummer: | T322E336K035AT |
| Levetid @ Temp.: | - |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | General Purpose |
| Strykprosent: | - |
| Utvidet beskrivelse: | 33µF ±10% Molded Tantalum Capacitors 35V Axial 1 Ohm |
| ESR (ekvivalent serieresistens): | 1 Ohm |
| Beskrivelse: | CAP TANT 33UF 35V 10% AXIAL |
| kapasitans: | 33µF |
| Email: | [email protected] |
Beslektede deler til T322E336K035AT
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
T322E336K020AS | KEMET | CAP TANT 33UF 20V 10% AXIAL | Forespørsel |
|
T322E336K035AS | KEMET | CAP TANT 33UF 35V 10% AXIAL | Forespørsel |
|
T322E336K025AS | KEMET | CAP TANT 33UF 25V 10% AXIAL | Forespørsel |
|
T322E336K020AT | KEMET | CAP TANT 33UF 20V 10% AXIAL | Forespørsel |
|
T322E336K025AT | KEMET | CAP TANT 33UF 25V 10% AXIAL | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers