Kjøpe TCS800 med BYCHPS
Kjøp med garanti
TCS800
- Delenummer:
- TCS800
- Produsent:
- Microsemi
- Beskrivelse:
- TRANS RF BIPO 1944W 50A 55SM1
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15586 Pieces
- Dataark:
- TCS800.pdf
Introduksjon
BYCHIPS er strømprodusenten for TCS800, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for TCS800 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 65V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Enhetspakke: | 55SM |
| Serie: | - |
| Strøm - Maks: | 1944W |
| emballasje: | Bulk |
| Pakke / tilfelle: | 55SM |
| Driftstemperatur: | 230°C (TJ) |
| Støy Figur (dB Typ @ f): | - |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | TCS800 |
| Gevinst: | 8dB ~ 9dB |
| Frekvens - Overgang: | 1.03GHz |
| Utvidet beskrivelse: | RF Transistor NPN 65V 50A 1.03GHz 1944W Chassis Mount 55SM |
| Beskrivelse: | TRANS RF BIPO 1944W 50A 55SM1 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 5A, 5V |
| Nåværende - Samler (Ic) (Maks): | 50A |
| Email: | [email protected] |
Beslektede deler til TCS800
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
AT-32033-TR1G | Broadcom Limited | IC TRANS NPN BIPOLAR SOT-23 | Forespørsel |
 |
2301 | Microsemi Corporation | TRANS HBT RF BIPOLAR 55BT | Forespørsel |
 |
KSC2786YBU | Fairchild/ON Semiconductor | TRANSISTOR NPN 20V 20MA TO-92S | Forespørsel |
 |
MRF428 | M/A-Com Technology Solutions | TRANS RF NPN 55V 20A 211-11 | Forespørsel |
 |
MMBTH10-7 | Diodes Incorporated | TRANS NPN VHF/UHF 25V SOT23-3 | Forespørsel |
 |
HFA3127B96 | Intersil | IC TRANS ARRAY NPN 16-SOIC | Forespørsel |
 |
BLS2731-50,114 | Ampleon USA Inc. | TRANSISTOR RF POWER SOT422A | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers