Kjøpe TDA1308AUK,027 med BYCHPS
Kjøp med garanti
TDA1308AUK,027
- Delenummer:
- TDA1308AUK,027
- Produsent:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC AMP AUDIO .08W STER AB 8WLCSP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13044 Pieces
- Dataark:
- TDA1308AUK,027.pdf
Introduksjon
BYCHIPS er strømprodusenten for TDA1308AUK,027, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for TDA1308AUK,027 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.4 V ~ 7 V, ±1.2 V ~ 3.5 V |
|---|---|
| Type: | Class AB |
| Leverandør Enhetspakke: | 8-WLCSP |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 8-XFBGA, WLCSP |
| Utgangstype: | Headphones, 2-Channel (Stereo) |
| Andre navn: | 568-4184-2 935280856027 TDA1308AUK-G |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Maks. Utgangseffekt x Kanaler @ Last: | 80mW x 2 @ 32 Ohm |
| Produsentens varenummer: | TDA1308AUK,027 |
| Egenskaper: | Depop, Short-Circuit Protection |
| Utvidet beskrivelse: | Amplifier IC Headphones, 2-Channel (Stereo) Class AB 8-WLCSP |
| Beskrivelse: | IC AMP AUDIO .08W STER AB 8WLCSP |
| Email: | [email protected] |
Beslektede deler til TDA1308AUK,027
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
TDA1308TT/N2,118 | NXP USA Inc. | IC AMP AUDIO .08W STER AB 8TSSOP | Forespørsel |
 |
TDA1308AT/N2,112 | NXP USA Inc. | IC AMP AUDIO 3W STER AB 8SOIC | Forespørsel |
|
TDA1308T/N2,115 | NXP USA Inc. | IC AMP AUDIO 3W STER AB 8SOIC | Forespørsel |
|
TDA1308AT/N2,115 | NXP USA Inc. | IC AMP AUDIO .08W STER AB 8SOIC | Forespørsel |
|
TDA1308T/N2,112 | NXP USA Inc. | IC AMP AUDIO .08W STER AB 8SOIC | Forespørsel |
 |
TDA1308/N2,112 | NXP USA Inc. | IC AMP AUDIO 3W STER AB 8DIP | Forespørsel |
|
TDA1308T/N1,112 | NXP USA Inc. | IC AMP AUDIO .08W STER AB 8SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers