Kjøpe TL16PIR552PH med BYCHPS
Kjøp med garanti
TL16PIR552PH
- Delenummer:
- TL16PIR552PH
- Produsent:
- Beskrivelse:
- IC DUAL UART W/FIFO 80-QFP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12705 Pieces
- Dataark:
- TL16PIR552PH.pdf
Introduksjon
BYCHIPS er strømprodusenten for TL16PIR552PH, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for TL16PIR552PH via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Med Modem Control: | Yes |
|---|---|
| Med IrDA Encoder / dekoder: | Yes |
| Med False Start Bit Detection: | Yes |
| Med automatisk flytkontroll: | Yes |
| Spenning - Forsyning: | 4.75 V ~ 5.25 V |
| Leverandør Enhetspakke: | 80-QFP (14x20) |
| Serie: | - |
| protokoll: | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 80-BQFP |
| Andre navn: | 296-6595-5 TL16PIR552PHG4 TL16PIR552PHG4-ND |
| Antall kanaler: | 2, DUART |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | TL16PIR552PH |
| Egenskaper: | Printer Port |
| FIFO s: | 16 Byte |
| Beskrivelse: | IC DUAL UART W/FIFO 80-QFP |
| Datahastighet (maks): | 1Mbps |
| Email: | [email protected] |
Beslektede deler til TL16PIR552PH
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SC16C754BIBM,128 | NXP USA Inc. | IC UART QUAD 64BYTE 64LQFP | Forespørsel |
|
SC16C852LIBS,128 | NXP USA Inc. | IC UART DUAL W/FIFO 32-HVQFN | Forespørsel |
 |
XR16M2651IM48TR-F | Exar Corporation | IC UART FIFO 32B DUAL 48TQFP | Forespørsel |
 |
ST16C654CQ64TR-F | Exar Corporation | IC UART FIFO 64B QUAD 64LQFP | Forespørsel |
|
XR16M680IM48-F | Exar Corporation | IC UART FIFO 32B 48TQFP | Forespørsel |
|
TL16CP754CPMR | Texas Instruments | IC QUAD UART W/64B FIFO 64-LQFP | Forespørsel |
 |
ST16C1550CJ28TR-F | Exar Corporation | IC UART FIFO 16B 28PLCC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers