Kjøpe TPIC8101DWG4 med BYCHPS
Kjøp med garanti
TPIC8101DWG4
- Delenummer:
- TPIC8101DWG4
- Produsent:
- Beskrivelse:
- IC KNOCK SENSOR INTERFACE 20SOIC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18638 Pieces
- Dataark:
- TPIC8101DWG4.pdf
Introduksjon
BYCHIPS er strømprodusenten for TPIC8101DWG4, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for TPIC8101DWG4 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Sensor Interface |
|---|---|
| Leverandør Enhetspakke: | 20-SOIC |
| Serie: | Automotive, AEC-Q100 |
| emballasje: | Tube |
| Pakke / tilfelle: | 20-SOIC (0.295", 7.50mm Width) |
| Utgangstype: | Serial |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | TPIC8101DWG4 |
| Interface: | SPI |
| Inngangstype: | Serial |
| Beskrivelse: | IC KNOCK SENSOR INTERFACE 20SOIC |
| Strøm - Forsyning: | 20mA |
| Email: | [email protected] |
Beslektede deler til TPIC8101DWG4
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
|
TPIC8101DWR | Texas Instruments | IC KNOCK SENSOR INTERFACE 20SOIC | Forespørsel |
|
TPIC8101DWRG4 | Texas Instruments | IC KNOCK SENSOR INTERFACE 20SOIC | Forespørsel |
 |
MLX90308LDF-DAA-000-SP | Melexis Technologies NV | IC SENSOR PROG INTERFACE 16SOIC | Forespørsel |
|
TPIC8101DW | Texas Instruments | IC KNOCK SENSOR INTERFACE 20SOIC | Forespørsel |
|
XTR114UA | Texas Instruments | IC 4-20MA TRANSMITTER 14-SOIC | Forespørsel |
 |
A5358CA | Allegro MicroSystems, LLC | IC SMOKE DETECTOR PHOTO 16DIP | Forespørsel |
|
TPIC83000IPWRQ1 | Texas Instruments | IC SENSOR SIGNAL COND 16TSSOP | Forespørsel |
|
ADA4350ARUZ-R7 | Analog Devices Inc. | IC AFE FET INPUT ADC DVR 28TSSOP | Forespørsel |
|
XTR115UA/2K5G4 | Texas Instruments | IC 4 TO 20MA TRANSMITTER 8-SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers