Kjøpe TVB006SB-L med BYCHPS
Kjøp med garanti
TVB006SB-L
- Delenummer:
- TVB006SB-L
- Produsent:
- Littelfuse
- Beskrivelse:
- THYRISTOR 6V 250A DO-214AA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19952 Pieces
- Dataark:
- TVB006SB-L.pdf
Introduksjon
BYCHIPS er strømprodusenten for TVB006SB-L, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for TVB006SB-L via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - på stat: | 4V |
|---|---|
| Spenning - Off State: | 6V |
| Spenning - Breakover: | 20V |
| Serie: | SiBar |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | DO-214AA, SMB |
| Andre navn: | TVB006SB-LTR |
| Antall elementer: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | TVB006SB-L |
| Beskrivelse: | THYRISTOR 6V 250A DO-214AA |
| Strøm - Peak Pulse (8 / 20μs): | 250A |
| Strøm - Peak Pulse (10 / 1000μs): | 75A |
| Nåværende - Hold (Ih): | 50mA |
| kapasitans: | 50pF |
| Email: | [email protected] |
Beslektede deler til TVB006SB-L
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
P3100EARP1 | Littelfuse Inc. | SIDACTOR BI 275V 150A TO-92 | Forespørsel |
 |
TISP4220H3LMFR | Bourns Inc. | SURGE SUPP THYRISTOR 160V TO-92 | Forespørsel |
 |
TVB006RSC-L | Littelfuse Inc. | THYRISTOR 6V 400A SMB | Forespørsel |
|
TISP4395M3LM | Bourns Inc. | SURGE SUPP THYRISTOR 320V TO-92 | Forespørsel |
|
P0080EBLAP | Littelfuse Inc. | SIDACTOR BI 6V 250A TO92 | Forespørsel |
 |
TISP4070L3BJR | Bourns Inc. | SURGE SUPP 58V BIDIR DO-214AA | Forespørsel |
 |
P0902SARP | Littelfuse Inc. | SIDAC ETHERNET BI 75V 150A DO214 | Forespørsel |
 |
P0602AA60 | Littelfuse Inc. | SIDACTOR 2CHP 25/50V 150A TO-220 | Forespørsel |
 |
P3602AA | Littelfuse Inc. | SIDAC 2CHP 170/340V 150A TO-220 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers