Kjøpe TZ03R121E169B00 med BYCHPS
Kjøp med garanti
TZ03R121E169B00
- Delenummer:
- TZ03R121E169B00
- Produsent:
- Murata Electronics
- Beskrivelse:
- CAP TRIMMER 10-120PF 50V TH
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19663 Pieces
- Dataark:
- TZ03R121E169B00.pdf
Introduksjon
BYCHIPS er strømprodusenten for TZ03R121E169B00, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for TZ03R121E169B00 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 50V |
|---|---|
| Størrelse / Dimensjon: | Round - 0.236" Dia (6.00mm) |
| Serie: | TZ03 |
| emballasje: | Bulk |
| Andre navn: | 490-1956 |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | TZ03R121E169B00 |
| Høyde - sittende (maks): | 0.209" (5.30mm) |
| Egenskaper: | General Purpose |
| Utvidet beskrivelse: | 10 ~ 120pF Trimmer Capacitor 50V Bottom Adjustment Through Hole |
| Beskrivelse: | CAP TRIMMER 10-120PF 50V TH |
| Kapasitansområde: | 10 ~ 120pF |
| Justeringstype: | Bottom Adjustment |
| Email: | [email protected] |
Beslektede deler til TZ03R121E169B00
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
GHL5R500 | Sprague-Goodman | CAP TRIMMER TH | Forespørsel |
|
GUN1R250 | Sprague-Goodman | CAP TRIM 0.3-1.2PF 500V | Forespørsel |
|
GMD40100 | Sprague-Goodman | CAP TRIM 5-30PF 175V THRU HOLE | Forespørsel |
 |
CTZ3E-03A-W1 | AVX Corporation | CAP TRIMMER 1-3PF 25V SMD | Forespørsel |
 |
TZ03R900E169B00 | Murata Electronics North America | CAP TRIMMER 9-90PF 50V TH | Forespørsel |
 |
TZ03R300E169B00 | Murata Electronics North America | CAP TRIMMER 5.2-30PF 100V TH | Forespørsel |
 |
TZ03R200E169B00 | Murata Electronics North America | CAP TRIMMER 4.2-20PF 100V TH | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers