Kjøpe U2739M-BFT med BYCHPS
Kjøp med garanti
U2739M-BFT
- Delenummer:
- U2739M-BFT
- Produsent:
- Micrel / Microchip Technology
- Beskrivelse:
- IC DECODER 1CHAN/SOURCE 100QFP
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 18483 Pieces
- Dataark:
- U2739M-BFT.pdf
Introduksjon
BYCHIPS er strømprodusenten for U2739M-BFT, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for U2739M-BFT via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 100-TQFP (14x14) |
| spesifikasjoner: | DAB |
| Serie: | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 100-TQFP |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall kanaler: | 2 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | U2739M-BFT |
| Interface: | I²C, I²S, SPDIF |
| Funksjon: | Demodulator |
| Utvidet beskrivelse: | Audio Demodulator 2 Channel 100-TQFP (14x14) |
| Beskrivelse: | IC DECODER 1CHAN/SOURCE 100QFP |
| applikasjoner: | Consumer Audio |
| Email: | [email protected] |
Beslektede deler til U2739M-BFT
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
LV25500PQA-NH | ON Semiconductor | IC BROADCASTING RCVR FM 56WQFN | Forespørsel |
 |
LM1971MX | Texas Instruments | IC AUDIO ATTENUATOR DIG 8-SOIC | Forespørsel |
|
TDA7463AD | STMicroelectronics | IC PROCESSOR AUDIO DGTL 20-SSOP | Forespørsel |
 |
ZL38042LDG1 | Microsemi Corporation | IC AUDIO PROCESSOR DSP 64QFN | Forespørsel |
|
STA120D | STMicroelectronics | IC RECEIVER AUDIO DIGITAL 28SOIC | Forespørsel |
|
TAS5036BPFC | Texas Instruments | IC 6-CH DIG AUD PWM PROC 80-TQFP | Forespørsel |
|
TAS5508BPAGG4 | Texas Instruments | IC DIGITAL AUDIO PWM 8CH 64-TQFP | Forespørsel |
 |
BU7814KN-E2 | Rohm Semiconductor | IC LSI AUDIO INTERFACE VQFN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers