Kjøpe UPA2766T1A-E2-AY med BYCHPS
Kjøp med garanti
UPA2766T1A-E2-AY
- Delenummer:
- UPA2766T1A-E2-AY
- Produsent:
- Renesas Electronics America
- Beskrivelse:
- MOSFET N-CH 30V 130A 8HVSON
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18436 Pieces
- Dataark:
- UPA2766T1A-E2-AY.pdf
Introduksjon
BYCHIPS er strømprodusenten for UPA2766T1A-E2-AY, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for UPA2766T1A-E2-AY via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | - |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Enhetspakke: | 8-HVSON (5.4x5.15) |
| Serie: | - |
| Rds På (Maks) @ Id, Vgs: | 1.82 mOhm @ 39A, 4.5V |
| Strømdissipasjon (maks): | 1.5W (Ta), 83W (Tc) |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 8-PowerVDFN |
| Andre navn: | UPA2766T1A-E2-AYTR UPA2766T1AE2AY |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | UPA2766T1A-E2-AY |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 10850pF @ 10V |
| Gateavgift (Qg) (Maks) @ Vgs: | 257nC @ 10V |
| FET Type: | N-Channel |
| FET-funksjonen: | - |
| Utvidet beskrivelse: | N-Channel 30V 130A (Tc) 1.5W (Ta), 83W (Tc) Surface Mount 8-HVSON (5.4x5.15) |
| Drain til Source Voltage (VDSS): | 30V |
| Beskrivelse: | MOSFET N-CH 30V 130A 8HVSON |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 130A (Tc) |
| Email: | [email protected] |
Beslektede deler til UPA2766T1A-E2-AY
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers