Kjøpe UPD70F3451GC(R)-UBT-A med BYCHPS
Kjøp med garanti
UPD70F3451GC(R)-UBT-A
- Delenummer:
- UPD70F3451GC(R)-UBT-A
- Produsent:
- Renesas Electronics America
- Beskrivelse:
- IC MCU 32BIT 128KB FLASH 80LQFP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15268 Pieces
- Dataark:
- UPD70F3451GC(R)-UBT-A.pdf
Introduksjon
BYCHIPS er strømprodusenten for UPD70F3451GC(R)-UBT-A, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for UPD70F3451GC(R)-UBT-A via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning (Vcc / Vdd): | 3.5 V ~ 5.5 V |
|---|---|
| Leverandør Enhetspakke: | 80-LQFP (14x14) |
| Hastighet: | 64MHz |
| Serie: | V850E/Ix3 |
| RAM-størrelse: | 8K x 8 |
| Programminnetype: | FLASH |
| Programminnestørrelse: | 128KB (128K x 8) |
| periferi~~POS=TRUNC: | DMA, LVD, PWM, WDT |
| emballasje: | Tray |
| Pakke / tilfelle: | 80-LQFP |
| Oscillator type: | External |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall I / O: | 44 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 24 Weeks |
| Produsentens varenummer: | UPD70F3451GC(R)-UBT-A |
| Utvidet beskrivelse: | V850ES V850E/Ix3 Microcontroller IC 32-Bit 64MHz 128KB (128K x 8) FLASH 80-LQFP (14x14) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 32BIT 128KB FLASH 80LQFP |
| Datakonvertere: | A/D 10x12b, 4x10b |
| Kjernestørrelse: | 32-Bit |
| Kjerneprosessor: | V850ES |
| tilkobling: | CSI, I²C, UART/USART |
| Email: | [email protected] |
Beslektede deler til UPD70F3451GC(R)-UBT-A
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers