Kjøpe UPD70F3529GMA9-GBK-G med BYCHPS
Kjøp med garanti
UPD70F3529GMA9-GBK-G
- Delenummer:
- UPD70F3529GMA9-GBK-G
- Produsent:
- Renesas Electronics America
- Beskrivelse:
- IC MCU 32BIT 2GB FLASH 176HLQFP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13305 Pieces
- Dataark:
- UPD70F3529GMA9-GBK-G.pdf
Introduksjon
BYCHIPS er strømprodusenten for UPD70F3529GMA9-GBK-G, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for UPD70F3529GMA9-GBK-G via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning (Vcc / Vdd): | 2.7 V ~ 5.5 V |
|---|---|
| Leverandør Enhetspakke: | 176-HLQFP (24x24) |
| Hastighet: | 80MHz |
| Serie: | V850E2/Dx4-H |
| RAM-størrelse: | 96K x 8 |
| Programminnetype: | FLASH |
| Programminnestørrelse: | 2GB (2G x 8) |
| periferi~~POS=TRUNC: | DMA, I²S, LCD, LVD, POR, PWM, WDT |
| emballasje: | Tray |
| Pakke / tilfelle: | 176-LQFP Exposed Pad |
| Oscillator type: | Internal |
| Driftstemperatur: | -40°C ~ 105°C (TA) |
| Antall I / O: | 127 |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 24 Weeks |
| Produsentens varenummer: | UPD70F3529GMA9-GBK-G |
| Utvidet beskrivelse: | V850E2M V850E2/Dx4-H Microcontroller IC 32-Bit 80MHz 2GB (2G x 8) FLASH 176-HLQFP (24x24) |
| EEPROM-størrelse: | 32K x 8 |
| Beskrivelse: | IC MCU 32BIT 2GB FLASH 176HLQFP |
| Datakonvertere: | A/D 12x10b, A/D 12x12b |
| Kjernestørrelse: | 32-Bit |
| Kjerneprosessor: | V850E2M |
| tilkobling: | CAN, CSI, I²C, LIN, SPI, UART/USART |
| Email: | [email protected] |
Beslektede deler til UPD70F3529GMA9-GBK-G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers