Kjøpe UXB02070F5629CCU00 med BYCHPS
Kjøp med garanti
UXB02070F5629CCU00
- Delenummer:
- UXB02070F5629CCU00
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- RES 56.2 OHM 1/4W .25% AXIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18172 Pieces
- Dataark:
- UXB02070F5629CCU00.pdf
Introduksjon
BYCHIPS er strømprodusenten for UXB02070F5629CCU00, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for UXB02070F5629CCU00 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±0.25% |
|---|---|
| Temperaturkoeffisient: | ±10ppm/°C |
| Leverandør Enhetspakke: | Axial |
| Størrelse / Dimensjon: | 0.098" Dia x 0.248" L (2.50mm x 6.30mm) |
| Serie: | UXB 0207 |
| Motstand (ohm): | 56.2 |
| Strøm (Watts): | 0.25W, 1/4W |
| emballasje: | Tape & Box (TB) |
| Pakke / tilfelle: | Axial |
| Andre navn: | UXB 0207-10 0.25 % CU 56R2 |
| Driftstemperatur: | -20°C ~ 125°C |
| Antall oppsigelser: | 2 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | UXB02070F5629CCU00 |
| Høyde - sittende (maks): | - |
| Egenskaper: | - |
| Strykprosent: | - |
| Utvidet beskrivelse: | 56.2 Ohm ±0.25% 0.25W, 1/4W Through Hole Resistor Axial Metal Film |
| Beskrivelse: | RES 56.2 OHM 1/4W .25% AXIAL |
| sammensetning: | Metal Film |
| Email: | [email protected] |
Beslektede deler til UXB02070F5629CCU00
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
UXB02070H4802BCU00 | Vishay BC Components | RES 48K OHM 1/4W 0.1% AXIAL | Forespørsel |
|
UXB02070H5000BCU00 | Vishay BC Components | RES 500 OHM 1/4W 0.1% AXIAL | Forespørsel |
|
UXB02070G1002BCU00 | Vishay BC Components | RES 10K OHM 1/4W 0.1% AXIAL | Forespørsel |
|
UXB02070G2371BCU00 | Vishay BC Components | RES 2.37K OHM 1/4W 0.1% AXIAL | Forespørsel |
|
UXB02070G1002TCU00 | Vishay BC Components | RES 10K OHM 1/4W 0.01% AXIAL | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers