Kjøpe VLA606-01R med BYCHPS
Kjøp med garanti
VLA606-01R
- Delenummer:
- VLA606-01R
- Produsent:
- Powerex, Inc.
- Beskrivelse:
- KIT IPM DRIVE INTERFACE MOD OPTO
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15418 Pieces
- Dataark:
- 1.VLA606-01R.pdf2.VLA606-01R.pdf
Introduksjon
BYCHIPS er strømprodusenten for VLA606-01R, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for VLA606-01R via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | - |
|---|---|
| Leverandør Enhetspakke: | Module |
| Serie: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | Module |
| Driftstemperatur: | -20°C ~ 70°C |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 18 Weeks |
| Produsentens varenummer: | VLA606-01R |
| Utvidet beskrivelse: | IPM Drive Interface PMIC Module |
| Beskrivelse: | KIT IPM DRIVE INTERFACE MOD OPTO |
| Strøm - Forsyning: | 20mA |
| applikasjoner: | IPM Drive Interface |
| Email: | [email protected] |
Beslektede deler til VLA606-01R
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
TPS65721RSNR | Texas Instruments | IC PMU 2CH CONV/LDO 32QFN | Forespørsel |
 |
P9036A-0NTGI | IDT, Integrated Device Technology Inc | IC WIRELESS TRANSMITTER 48TQFN | Forespørsel |
|
UC3902DTR | Texas Instruments | IC LOAD SHARE CONTROLLER 8SOIC | Forespørsel |
|
LP5552TL/NOPB | Texas Instruments | IC ENERGY MANAGEMENT 36USMD | Forespørsel |
|
MAX17019ATM+T | Maxim Integrated | IC VOLT CTRL QUAD OUT 48TQFN | Forespørsel |
 |
MC34709VKR2 | NXP USA Inc. | IC PWR MGMT IMX50/53 130MAPBGA | Forespørsel |
 |
MAX5039EUA | Maxim Integrated | IC CNTRLR VOLT TRACK 8-MSOP | Forespørsel |
 |
MC34827A1EPR2 | NXP USA Inc. | IC USB POWER MANAGER 20-QFN | Forespørsel |
 |
LTC4365HDDB-1#TRMPBF | Linear Technology | IC OVERVOLTAGE PROTECT 8-DFN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers