Kjøpe VPH2-0116-R med BYCHPS
Kjøp med garanti
VPH2-0116-R
- Delenummer:
- VPH2-0116-R
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- INDUCT ARRAY 6 COIL 11.6UH SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15406 Pieces
- Dataark:
- VPH2-0116-R.pdf
Introduksjon
BYCHIPS er strømprodusenten for VPH2-0116-R, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for VPH2-0116-R via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | - |
|---|---|
| Størrelse / Dimensjon: | 0.642" L x 0.661" W (16.30mm x 16.80mm) |
| skjerming: | Unshielded |
| Serie: | VERSA-PAC® |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 12-SMD |
| Andre navn: | VPH2-0116 VPH2-0116-ND VPH2-0116-R-ND VPH20116R |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall ruller: | 6 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | VPH2-0116-R |
| Høyde: | 0.307" (7.80mm) |
| Utvidet beskrivelse: | Unshielded Coil Inductor Array 12-SMD |
| Beskrivelse: | INDUCT ARRAY 6 COIL 11.6UH SMD |
| DC-motstand (DCR) - Serie: | - |
| DC-motstand (DCR) - Parallell: | - |
| Email: | [email protected] |
Beslektede deler til VPH2-0116-R
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
744851101 | Wurth Electronics Inc. | INDUCT ARRAY 2 COIL 10UH SMD | Forespørsel |
 |
VPH2-0083-R | Eaton | INDUCT ARRAY 6 COIL 8.3UH SMD | Forespørsel |
 |
PM620-12-B | Bourns Inc. | INDUCT ARRAY 6 COIL 3.8UH SMD | Forespørsel |
|
VPH2-1600-R | Eaton | INDUCT ARRAY 6 COIL 160UH SMD | Forespørsel |
|
PM620-03-RC | Bourns Inc. | INDUCT ARRAY 6 COIL 131.8UH SMD | Forespørsel |
|
VPH2-0216-R | Eaton | INDUCT ARRAY 6 COIL 21.6UH SMD | Forespørsel |
|
VPH2-0066-R | Eaton | INDUCT ARRAY 6 COIL 6.6UH SMD | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers