Kjøpe W631GG8KB-11 TR med BYCHPS
Kjøp med garanti
W631GG8KB-11 TR
- Delenummer:
- W631GG8KB-11 TR
- Produsent:
- Winbond Electronics Corporation
- Beskrivelse:
- IC SDRAM 1GBIT 933MHZ 78BGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19626 Pieces
- Dataark:
- W631GG8KB-11 TR.pdf
Introduksjon
BYCHIPS er strømprodusenten for W631GG8KB-11 TR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for W631GG8KB-11 TR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 1.425 V ~ 1.575 V |
|---|---|
| Leverandør Enhetspakke: | 78-WBGA (10.5x8) |
| Hastighet: | 933MHz |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 78-TFBGA |
| Driftstemperatur: | 0°C ~ 95°C (TC) |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Minnetype: | Volatile |
| Minnestørrelse: | 1Gb (128M x 8) |
| Minneformat: | DRAM |
| Produsentens varenummer: | W631GG8KB-11 TR |
| Interface: | Parallel |
| Beskrivelse: | IC SDRAM 1GBIT 933MHZ 78BGA |
| Email: | [email protected] |
Beslektede deler til W631GG8KB-11 TR
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
W631GG8KB-11 | Winbond Electronics | IC SDRAM 1GBIT 933MHZ 78BGA | Forespørsel |
|
W631GG8KB15I TR | Winbond Electronics | IC SDRAM 1GBIT 667MHZ 78BGA | Forespørsel |
|
W631GG8KB12I TR | Winbond Electronics | IC SDRAM 1GBIT 800MHZ 78BGA | Forespørsel |
|
W631GG8KB-12 TR | Winbond Electronics | IC SDRAM 1GBIT 800MHZ 78BGA | Forespørsel |
|
W631GG8KB-12 | Winbond Electronics | IC SDRAM 1GBIT 800MHZ 78BGA | Forespørsel |
|
W631GG8KB-15 TR | Winbond Electronics | IC SDRAM 1GBIT 667MHZ 78BGA | Forespørsel |
|
W631GG8KB-15 | Winbond Electronics | IC SDRAM 1GBIT 667MHZ 78BGA | Forespørsel |
|
W631GG8KB15I | Winbond Electronics | IC SDRAM 1GBIT 667MHZ 78BGA | Forespørsel |
|
W631GG8KB12I | Winbond Electronics | IC SDRAM 1GBIT 800MHZ 78BGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers