Kjøpe W9464G6KH-4 med BYCHPS
Kjøp med garanti
W9464G6KH-4
- Delenummer:
- W9464G6KH-4
- Produsent:
- Winbond Electronics Corporation
- Beskrivelse:
- IC SDRAM 64MBIT 250MHZ 66TSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16565 Pieces
- Dataark:
- W9464G6KH-4.pdf
Introduksjon
BYCHIPS er strømprodusenten for W9464G6KH-4, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for W9464G6KH-4 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.4 V ~ 2.7 V |
|---|---|
| Leverandør Enhetspakke: | 66-TSOP II |
| Hastighet: | 250MHz |
| Serie: | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 66-TSSOP (0.400", 10.16mm Width) |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Minnetype: | Volatile |
| Minnestørrelse: | 64Mb (4M x 16) |
| Minneformat: | DRAM |
| Produsentens varenummer: | W9464G6KH-4 |
| Interface: | Parallel |
| Beskrivelse: | IC SDRAM 64MBIT 250MHZ 66TSOP |
| Email: | [email protected] |
Beslektede deler til W9464G6KH-4
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
W9464G6KH-5I | Winbond Electronics | IC SDRAM 64MBIT 200MHZ 66TSOP | Forespørsel |
|
W9464G6KH-5I TR | Winbond Electronics | IC SDRAM 64MBIT 200MHZ 66TSOP | Forespørsel |
|
W9464G6KH-5 | Winbond Electronics | IC SDRAM 64MBIT 200MHZ 66TSOP | Forespørsel |
|
W9464G6KH-5 TR | Winbond Electronics | IC SDRAM 64MBIT 200MHZ 66TSOP | Forespørsel |
|
W9464G6JH-4 | Winbond Electronics | IC SDRAM 64MBIT 200MHZ 66TSOP | Forespørsel |
|
W9464G6KH-4 TR | Winbond Electronics | IC SDRAM 64MBIT 250MHZ 66TSOP | Forespørsel |
|
W9464G6JH-5 | Winbond Electronics | IC SDRAM 64MBIT 200MHZ 66TSOP | Forespørsel |
|
W9464G6JH-5I | Winbond Electronics | IC SDRAM 64MBIT 200MHZ 66TSOP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers