Kjøpe X66AK2H06AAW24 med BYCHPS
Kjøp med garanti
X66AK2H06AAW24
- Delenummer:
- X66AK2H06AAW24
- Produsent:
- Beskrivelse:
- IC DSP ARM SOC BGA
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 14210 Pieces
- Dataark:
- X66AK2H06AAW24.pdf
Introduksjon
BYCHIPS er strømprodusenten for X66AK2H06AAW24, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for X66AK2H06AAW24 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - I / O: | 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V |
|---|---|
| Spenning - Core: | Variable |
| Type: | DSP+ARM® |
| Leverandør Enhetspakke: | 1517-FCBGA (40x40) |
| Serie: | 66AK2Hx KeyStone Multicore |
| emballasje: | Tray |
| Pakke / tilfelle: | 1517-BBGA, FCBGA |
| Driftstemperatur: | 0°C ~ 85°C (TC) |
| On-Chip RAM: | 8.375MB |
| Ikke-flyktig minne: | ROM (384 kB) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | X66AK2H06AAW24 |
| Interface: | EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0 |
| Beskrivelse: | IC DSP ARM SOC BGA |
| Klokkefrekvens: | 1.2GHz DSP, 1.4GHz ARM® |
| Email: | [email protected] |
Beslektede deler til X66AK2H06AAW24
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
|
X66AK2H06XAAW2 | Texas Instruments | IC DSP ARM SOC BGA | Forespørsel |
|
X66AK2H06AAAWA2 | Texas Instruments | IC DSP ARM SOC BGA | Forespørsel |
|
X66AK2H06AAW2 | Texas Instruments | IC DSP ARM SOC BGA | Forespørsel |
|
X66AK2H06AAAW24 | Texas Instruments | IC DSP ARM SOC BGA | Forespørsel |
|
X66AK2H06AXAAW2 | Texas Instruments | IC DSP ARM SOC BGA | Forespørsel |
|
X66AK2H06AAWA24 | Texas Instruments | IC DSP ARM SOC BGA | Forespørsel |
|
X66AK2H06AAAWA24 | Texas Instruments | IC DSP ARM SOC BGA | Forespørsel |
|
X66AK2H06AAWA2 | Texas Instruments | IC DSP ARM SOC BGA | Forespørsel |
|
X66AK2H06AAAW2 | Texas Instruments | IC DSP ARM SOC BGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog