Kjøpe XA3S1000-4FGG456Q med BYCHPS
Kjøp med garanti
XA3S1000-4FGG456Q
- Delenummer:
- XA3S1000-4FGG456Q
- Produsent:
- Xilinx
- Beskrivelse:
- IC FPGA 333 I/O 456FBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15542 Pieces
- Dataark:
- XA3S1000-4FGG456Q.pdf
Introduksjon
BYCHIPS er strømprodusenten for XA3S1000-4FGG456Q, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for XA3S1000-4FGG456Q via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 1.14 V ~ 1.26 V |
|---|---|
| Totalt RAM-bit: | 442368 |
| Leverandør Enhetspakke: | 456-FBGA (23x23) |
| Serie: | Automotive, AEC-Q100, Spartan®-3 XA |
| Pakke / tilfelle: | 456-BBGA |
| Driftstemperatur: | -40°C ~ 125°C (TJ) |
| Antall logiske elementer / celler: | 17280 |
| Antall LAB / CLBer: | 1920 |
| Antall I / O: | 333 |
| Antall porte: | 1000000 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | XA3S1000-4FGG456Q |
| Beskrivelse: | IC FPGA 333 I/O 456FBGA |
| Email: | [email protected] |
Beslektede deler til XA3S1000-4FGG456Q
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
XA3S100E-4VQG100I | Xilinx Inc. | IC FPGA 66 I/O 100VQFP | Forespørsel |
 |
XA3S1000-4FTG256I | Xilinx Inc. | IC FPGA 173 I/O 256FTBGA | Forespørsel |
 |
XA3S100E-4CPG132Q | Xilinx Inc. | IC FPGA 83 I/O 132CSBGA | Forespørsel |
 |
XA3S100E-4TQG144I | Xilinx Inc. | IC FPGA 108 I/O 144TQFP | Forespørsel |
|
XA3S100E-4CPG132I | Xilinx Inc. | IC FPGA 83 I/O 132CSBGA | Forespørsel |
 |
XA3S1000-4FGG456I | Xilinx Inc. | IC FPGA 333 I/O 456FBGA | Forespørsel |
|
XA3S100E-4TQG144Q | Xilinx Inc. | IC FPGA 108 I/O 144TQFP | Forespørsel |
|
XA3S1000-4FTG256Q | Xilinx Inc. | IC FPGA 173 I/O 256FTBGA | Forespørsel |
|
XA3S100E-4VQG100Q | Xilinx Inc. | IC FPGA 66 I/O 100VQFP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers