Kjøpe XC1736EPDG8C med BYCHPS
Kjøp med garanti
XC1736EPDG8C
- Delenummer:
- XC1736EPDG8C
- Produsent:
- Xilinx
- Beskrivelse:
- IC PROM SERIAL CONFIG 36K 8-DIP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19715 Pieces
- Dataark:
- XC1736EPDG8C.pdf
Introduksjon
BYCHIPS er strømprodusenten for XC1736EPDG8C, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for XC1736EPDG8C via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 4.75 V ~ 5.25 V |
|---|---|
| Leverandør Enhetspakke: | 8-PDIP |
| Serie: | - |
| Programmerbar Type: | OTP |
| emballasje: | Tube |
| Pakke / tilfelle: | 8-DIP (0.300", 7.62mm) |
| Andre navn: | 122-1509 |
| Driftstemperatur: | 0°C ~ 70°C |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Minnestørrelse: | 36kb |
| Produsentens varenummer: | XC1736EPDG8C |
| Beskrivelse: | IC PROM SERIAL CONFIG 36K 8-DIP |
| Email: | [email protected] |
Beslektede deler til XC1736EPDG8C
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
XC1736EPD8I | Xilinx Inc. | IC PROM SER I-TEMP 36K 8-DIP | Forespørsel |
|
XC1736ESOG8C | Xilinx Inc. | IC PROM SERIAL CONFIG 36K 8-SOIC | Forespørsel |
 |
XC1736EPC20C | Xilinx Inc. | IC PROM SER C-TEMP 36K 20-PLCC | Forespørsel |
|
XC1736EVOG8C | Xilinx Inc. | IC PROM SERIAL 36K 8-SOIC | Forespørsel |
|
XC1736EPC20I | Xilinx Inc. | IC PROM SER I-TEMP 36K 20-PLCC | Forespørsel |
|
XC1736ESO8C | Xilinx Inc. | IC PROM SERIAL CONFIG 36K 8-SOIC | Forespørsel |
|
XC1736EVO8C | Xilinx Inc. | IC SER CFG PROM 36K 8-SOIC | Forespørsel |
|
XC1736ESO8I | Xilinx Inc. | IC PROM SER I-TEMP 36K 8-SOIC | Forespørsel |
|
XC1736EVO8I | Xilinx Inc. | IC SER CFG PROM 36K 8-SOIC | Forespørsel |
|
XC17S40SO20I | Xilinx Inc. | IC PROM PROG I-TEMP 5V 20-SOIC | Forespørsel |
|
XC17256ELPD8C | Xilinx Inc. | IC 3V SER CFG PROM 256K 8-DIP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers