Kjøpe XC17S40XLPD8C med BYCHPS
Kjøp med garanti
XC17S40XLPD8C
- Delenummer:
- XC17S40XLPD8C
- Produsent:
- Xilinx
- Beskrivelse:
- IC PROM PROG C-TEMP 3.3V 8-DIP
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 17713 Pieces
- Dataark:
- XC17S40XLPD8C.pdf
Introduksjon
BYCHIPS er strømprodusenten for XC17S40XLPD8C, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for XC17S40XLPD8C via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 8-PDIP |
| Serie: | - |
| Programmerbar Type: | OTP |
| emballasje: | Tube |
| Pakke / tilfelle: | 8-DIP (0.300", 7.62mm) |
| Andre navn: | 122-1273 XC17S40XLPD8C-ND |
| Driftstemperatur: | 0°C ~ 70°C |
| Minnestørrelse: | 400kb |
| Produsentens varenummer: | XC17S40XLPD8C |
| Beskrivelse: | IC PROM PROG C-TEMP 3.3V 8-DIP |
| Email: | [email protected] |
Beslektede deler til XC17S40XLPD8C
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
XC17S40XLPD8I | Xilinx Inc. | IC PROM PROG I-TEMP 3.3V 8-DIP | Forespørsel |
|
XC17S40XLPDG8C | Xilinx Inc. | IC PROM PROG C-TEMP 3.3V 8-DIP | Forespørsel |
|
XC17S40XLSO20I | Xilinx Inc. | IC PROM PROG I-TEMP 3.3V 20-SOIC | Forespørsel |
|
XC17S10PD8C | Xilinx Inc. | IC PROM PROG C-TEMP 3.3V 8-DIP | Forespørsel |
|
XC17S40XLSO20C | Xilinx Inc. | IC PROM PROG C-TEMP 3.3V 20-SOIC | Forespørsel |
|
XC17S40SO20C | Xilinx Inc. | IC PROM PROG C-TEMP 5V 20-SOIC | Forespørsel |
|
XC17S40SO20I | Xilinx Inc. | IC PROM PROG I-TEMP 5V 20-SOIC | Forespørsel |
|
XC17S40PD8I | Xilinx Inc. | IC PROM PROG I-TEMP 5V 8-DIP | Forespørsel |
|
XC17S10VOG8C | Xilinx Inc. | IC PROM SERIAL 10K 8-SOIC | Forespørsel |
 |
XC17S200AVQ44C | Xilinx Inc. | IC PROM SER 200000 C-TEMP 44VQFP | Forespørsel |
|
XC17S40PD8C | Xilinx Inc. | IC PROM PROG C-TEMP 5V 8-DIP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers