Kjøpe XQ7K325T-1RF676I med BYCHPS
Kjøp med garanti
XQ7K325T-1RF676I
- Delenummer:
- XQ7K325T-1RF676I
- Produsent:
- Xilinx
- Beskrivelse:
- IC FPGA KINTEX-7 676-FBGA
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 17613 Pieces
- Dataark:
- XQ7K325T-1RF676I.pdf
Introduksjon
BYCHIPS er strømprodusenten for XQ7K325T-1RF676I, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for XQ7K325T-1RF676I via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 0.87 V ~ 0.93 V |
|---|---|
| Totalt RAM-bit: | 16404480 |
| Leverandør Enhetspakke: | 676-FCBGA (27x27) |
| Serie: | Kintex®-7Q |
| Pakke / tilfelle: | 676-BBGA, FCBGA |
| Driftstemperatur: | -40°C ~ 100°C (TJ) |
| Antall logiske elementer / celler: | 326080 |
| Antall LAB / CLBer: | 25475 |
| Antall I / O: | 400 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 4 (72 Hours) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | XQ7K325T-1RF676I |
| Beskrivelse: | IC FPGA KINTEX-7 676-FBGA |
| Email: | [email protected] |
Beslektede deler til XQ7K325T-1RF676I
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
XQ7K325T-1RF676M | Xilinx Inc. | IC FPGA KINTEX-7 676-FBGA | Forespørsel |
|
XQ7K325T-1RF900M | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Forespørsel |
|
XQ7K325T-L2RF676E | Xilinx Inc. | IC FPGA KINTEX-7 676-FBGA | Forespørsel |
|
XQ7K325T-2RF676I | Xilinx Inc. | IC FPGA KINTEX-7 676-FBGA | Forespørsel |
|
XQ7K325T-L2RF900E | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Forespørsel |
|
XQ7K325T-1RF900I | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Forespørsel |
|
XQ7K325T-2RF900I | Xilinx Inc. | IC FPGA KINTEX-7 900-FBGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers