Kjøpe XR18910IL-67 med BYCHPS
Kjøp med garanti
XR18910IL-67
- Delenummer:
- XR18910IL-67
- Produsent:
- Exar Corporation
- Beskrivelse:
- SENSOR
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17299 Pieces
- Dataark:
- XR18910IL-67.pdf
Introduksjon
BYCHIPS er strømprodusenten for XR18910IL-67, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for XR18910IL-67 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Front End |
|---|---|
| Leverandør Enhetspakke: | 24-QFN (3.5x3.5) |
| Serie: | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 24-WFQFN Exposed Pad |
| Utgangstype: | - |
| Andre navn: | 1016-2117 |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | XR18910IL-67 |
| Interface: | I²C |
| Inngangstype: | - |
| Beskrivelse: | SENSOR |
| Strøm - Forsyning: | 457µA |
| Email: | [email protected] |
Beslektede deler til XR18910IL-67
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
XR18910ILTR-65 | Exar Corporation | SENSOR | Forespørsel |
 |
XR18910IL-66 | Exar Corporation | SENSOR | Forespørsel |
|
XR18910ILTR-64 | Exar Corporation | SENSOR | Forespørsel |
|
XR18910IL-65 | Exar Corporation | SENSOR | Forespørsel |
|
XR18910ILMTR-67 | Exar Corporation | SENSOR | Forespørsel |
|
XR18910ILMTR-64 | Exar Corporation | SENSOR | Forespørsel |
|
XR18910IL-64 | Exar Corporation | SENSOR | Forespørsel |
|
XR18910ILTR-66 | Exar Corporation | SENSOR | Forespørsel |
|
XR18910ILMTR-65 | Exar Corporation | SENSOR | Forespørsel |
|
XR18910ILTR-67 | Exar Corporation | SENSOR | Forespørsel |
|
XR18910ILMTR-66 | Exar Corporation | SENSOR | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers