Kjøpe XR28V384IM48TR-F med BYCHPS
Kjøp med garanti
XR28V384IM48TR-F
- Delenummer:
- XR28V384IM48TR-F
- Produsent:
- Exar Corporation
- Beskrivelse:
- IC QUAD UART W/FIFO 3.3V 48-TQFP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15935 Pieces
- Dataark:
- XR28V384IM48TR-F.pdf
Introduksjon
BYCHIPS er strømprodusenten for XR28V384IM48TR-F, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for XR28V384IM48TR-F via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3.3V |
|---|---|
| Leverandør Enhetspakke: | 48-TQFP (7x7) |
| Standarder: | - |
| Serie: | - |
| protokoll: | RS232, RS485 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 48-TQFP |
| Driftstemperatur: | -40°C ~ 85°C |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | XR28V384IM48TR-F |
| Interface: | LPC |
| Funksjon: | Controller |
| Utvidet beskrivelse: | RS232, RS485 Controller LPC Interface 48-TQFP (7x7) |
| Beskrivelse: | IC QUAD UART W/FIFO 3.3V 48-TQFP |
| Strøm - Forsyning: | 17mA |
| Email: | [email protected] |
Beslektede deler til XR28V384IM48TR-F
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
XR28V382IL32-F | Exar Corporation | IC DUAL UART W/FIFO 3.3V 32-QFN | Forespørsel |
 |
XR28V384IM48-F | Exar Corporation | IC QUAD UART W/FIFO 3.3V 48-TQFP | Forespørsel |
|
XR28V382IL32TR-F | Exar Corporation | IC DUAL UART W/FIFO 3.3V 32-QFN | Forespørsel |
 |
XR21B1421IL24-F | Exar Corporation | IC UART BRIDGE TO USB 1CH 24-QFN | Forespørsel |
 |
FT313HQ-T | FTDI, Future Technology Devices International Ltd | IC USB HS HOST CTRL QFN-64 | Forespørsel |
 |
CY7C63833-LTXCT | Cypress Semiconductor Corp | IC USB PERIPHERAL CTRLR 32VQFN | Forespørsel |
 |
KSZ8895RQ | Microchip Technology | IC 10/100-T 5 PORT SW 128QFP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers