Kjøpe ZLPBLST0S2064GR55W4 med BYCHPS
Kjøp med garanti
ZLPBLST0S2064GR55W4
- Delenummer:
- ZLPBLST0S2064GR55W4
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC OTP RC BLASTER 20-SOIC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18189 Pieces
Introduksjon
BYCHIPS er strømprodusenten for ZLPBLST0S2064GR55W4, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ZLPBLST0S2064GR55W4 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Microcontroller |
|---|---|
| Leverandør Enhetspakke: | 20-SOIC |
| Serie: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | 20-SOIC (0.295", 7.50mm Width) |
| Andre navn: | 269-4681-5 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | ZLPBLST0S2064GR55W4 |
| Utvidet beskrivelse: | Microcontroller IC Infrared 20-SOIC |
| Beskrivelse: | IC OTP RC BLASTER 20-SOIC |
| applikasjoner: | Infrared |
| Email: | [email protected] |
Beslektede deler til ZLPBLST0S2064GR55W4
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
ZLPBLST0H2064GR55W4 | Maxim Integrated | IC OTP RC BLASTER 20-SSOP | Forespørsel |
 |
ZLPBLST0P2064GR55W4 | Maxim Integrated | IC OTP RC BLASTER 20-DIP | Forespørsel |
 |
80HVPS1616CBRI | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 400FCBGA | Forespørsel |
|
80HCPS1616CHMG | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 400FCBGA | Forespørsel |
 |
TLE8264EXUMA1 | Infineon Technologies | IC SYSTEM BASIS CHIP DSO-36 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers