Kjøpe 28B0250-000 med BYCHPS
Kjøp med garanti
28B0250-000
- Delenummer:
- 28B0250-000
- Beskrivelse:
- FERRITE CORE 150 OHM SOLID
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19289 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 28B0250-000, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 28B0250-000 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Round |
|---|---|
| Serie: | 28 |
| rangeringer: | - |
| Ytre dimensjon: | 0.250" Dia (6.35mm) |
| Andre navn: | 240-2288 |
| Monteringstype: | Free Hanging |
| Materiale: | 28 |
| Produsentens varenummer: | 28B0250-000 |
| Lengde: | 0.500" (12.70mm) |
| Innvendig dimensjon: | 0.125" Dia (3.18mm) |
| Impedans @ Frekvens: | 150 Ohm @ 100MHz |
| Utvidet beskrivelse: | Solid Free Hanging Ferrite Core 150 Ohm @ 100MHz ID 0.125" Dia (3.18mm) OD 0.250" Dia (6.35mm) Length 0.500" (12.70mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 150 OHM SOLID |
| Email: | [email protected] |
Beslektede deler til 28B0250-000
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
28B0275-000 | Laird-Signal Integrity Products | FERRITE CORE 146 OHM SOLID 3.8MM | Forespørsel |
 |
28B0250-700 | Laird-Signal Integrity Products | FERRITE CORE 135 OHM SOLID | Forespørsel |
 |
KR16TT160918 | Panasonic - DTG | FERRITE CORE 110 OHM SOLID 9MM | Forespørsel |
 |
28B0250-100 | Laird-Signal Integrity Products | FERRITE CORE 182 OHM SOLID | Forespørsel |
|
28R1024-000 | Laird-Signal Integrity Products | FERRITE CORE 128 OHM SOLID | Forespørsel |
|
28R1022-000 | Laird-Signal Integrity Products | FERRITE CORE 91 OHM SOLID | Forespørsel |
 |
28B0268-000 | Laird-Signal Integrity Products | FERRITE CORE 138 OHM SOLID | Forespørsel |
 |
74270053 | Wurth Electronics Inc. | FERRITE CORE 258 OHM SOLID 8MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog