Kjøpe DS08MB200TSQ/NOPB med BYCHPS
Kjøp med garanti
DS08MB200TSQ/NOPB
- Delenummer:
- DS08MB200TSQ/NOPB
- Produsent:
- Beskrivelse:
- IC MULTIPLEXER LVDS 4CH 48WQFN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13886 Pieces
- Dataark:
- DS08MB200TSQ/NOPB.pdf
Introduksjon
BYCHIPS er strømprodusenten for DS08MB200TSQ/NOPB, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DS08MB200TSQ/NOPB via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Type: | Buffer, Multiplexer |
| Leverandør Enhetspakke: | 48-WQFN (7x7) |
| Signalkondisjonering: | - |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 48-WFQFN Exposed Pad |
| Produksjon: | LVDS |
| Andre navn: | DS08MB200TSQ DS08MB200TSQ/NOPBTR DS08MB200TSQNOPB DS08MB200TSQTR DS08MB200TSQTR-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall kanaler: | 4 x 1:2, 2:1 |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | DS08MB200TSQ/NOPB |
| Input: | BLVDS, CML, LVDS, LVPECL |
| Utvidet beskrivelse: | Buffer, Multiplexer 4 x 1:2, 2:1 Channel 800Mbps 48-WQFN (7x7) |
| Beskrivelse: | IC MULTIPLEXER LVDS 4CH 48WQFN |
| Forsinkelsestid: | 1.0ns |
| Datahastighet (maks): | 800Mbps |
| Strøm - Forsyning: | 225mA |
| Kapasitans - Input: | 3.5pF |
| applikasjoner: | LVDS |
| Email: | [email protected] |
Beslektede deler til DS08MB200TSQ/NOPB
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
|
DS08MB200TSQX/NOPB | Texas Instruments | IC MULTIPLEXER LVDS 4CH 48WQFN | Forespørsel |
|
DS25BR120TSDX/NOPB | Texas Instruments | IC REDRIVER LVDS 1CH 8WSON | Forespørsel |
|
DS100KR800SQE/NOPB | Texas Instruments | IC REDRIVER 8CH 10.3GBPS 54WQFN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers