Kjøpe FSB70250 med BYCHPS
Kjøp med garanti
FSB70250
- Delenummer:
- FSB70250
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- MODULE SPM 500V 3A 27-QFN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15242 Pieces
- Dataark:
- FSB70250.pdf
Introduksjon
BYCHIPS er strømprodusenten for FSB70250, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FSB70250 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Isolasjon: | 1500Vrms |
|---|---|
| Spenning: | 500V |
| Type: | MOSFET |
| Serie: | Motion-SPM® |
| Pakke / tilfelle: | 27-PowerLQFN Module |
| Andre navn: | FSB70250CT |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 25 Weeks |
| Produsentens varenummer: | FSB70250 |
| Utvidet beskrivelse: | Power Driver Module MOSFET 3 Phase 500V 3.3A 27-PowerLQFN Module |
| Beskrivelse: | MODULE SPM 500V 3A 27-QFN |
| Nåværende: | 3.3A |
| konfigurasjon: | 3 Phase |
| Email: | [email protected] |
Beslektede deler til FSB70250
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
FSB70625 | Fairchild/ON Semiconductor | MODULE SPM 250V 6.9A 27-QFN | Forespørsel |
 |
FSB70325 | Fairchild/ON Semiconductor | MODULE SPM 250V 4.1A 27-QFN | Forespørsel |
 |
PS12018-A | Powerex Inc. | MOD IPM 3PHASE IGBT 1200V 25A | Forespørsel |
 |
FSB70550 | Fairchild/ON Semiconductor | MODULE SPM 500V 5.3A PQFN | Forespørsel |
 |
FSB70450 | Fairchild/ON Semiconductor | MODULE SPM 500V 4.8A PQFN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers