Kjøpe IKCM20L60HAXKMA1 med BYCHPS
Kjøp med garanti
IKCM20L60HAXKMA1
- Delenummer:
- IKCM20L60HAXKMA1
- Beskrivelse:
- IFPS MODULES 24MDIP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19723 Pieces
- Dataark:
- IKCM20L60HAXKMA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for IKCM20L60HAXKMA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IKCM20L60HAXKMA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Isolasjon: | 2000Vrms |
|---|---|
| Spenning: | 600V |
| Type: | IGBT |
| Serie: | CIPOS™ |
| Pakke / tilfelle: | 24-PowerDIP Module (1.028", 26.10mm) |
| Andre navn: | SP001370940 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | IKCM20L60HAXKMA1 |
| Utvidet beskrivelse: | Power Driver Module IGBT 3 Phase 600V 20A 24-PowerDIP Module (1.028", 26.10mm) |
| Beskrivelse: | IFPS MODULES 24MDIP |
| Nåværende: | 20A |
| konfigurasjon: | 3 Phase |
| Email: | [email protected] |
Beslektede deler til IKCM20L60HAXKMA1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
IKCM20L60GAXKMA1 | Infineon Technologies | IFPS MODULES 24MDIP | Forespørsel |
|
IKCM20R60GDXKMA1 | Infineon Technologies | IFPS MODULES 24MDIP | Forespørsel |
|
IKCM20L60HDXKMA1 | Infineon Technologies | IFPS MODULES 24MDIP | Forespørsel |
|
IKCM20L60GDXKMA1 | Infineon Technologies | IFPS MODULES 24MDIP | Forespørsel |
 |
FNB51560T1 | Fairchild/ON Semiconductor | MODULE SPM 600V 15A SPM55 | Forespørsel |
 |
PS21245-EP | Powerex Inc. | MOD IPM 600V 20A DIP | Forespørsel |
 |
IGCM04F60HAXKMA1 | Infineon Technologies | IGBT 600V 24MDIP | Forespørsel |
 |
FSBB15CH60 | Fairchild/ON Semiconductor | SMART POWER MODULE 15A SPM27-CA | Forespørsel |
|
PP300D060 | Powerex Inc. | IGBT ASSY H-BRIDGE 600V 300A | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers