Kjøpe IXGX120N60B med BYCHPS
Kjøp med garanti
IXGX120N60B
- Delenummer:
- IXGX120N60B
- Produsent:
- IXYS Corporation
- Beskrivelse:
- IGBT 600V 200A 660W TO247
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17465 Pieces
- Dataark:
- IXGX120N60B.pdf
Introduksjon
BYCHIPS er strømprodusenten for IXGX120N60B, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IXGX120N60B via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.1V @ 15V, 120A |
| Testtilstand: | 480V, 100A, 2.4 Ohm, 15V |
| Td (på / av) @ 25 ° C: | 60ns/200ns |
| Bytte energi: | 2.4mJ (on), 5.5mJ (off) |
| Leverandør Enhetspakke: | PLUS247™-3 |
| Serie: | HiPerFAST™ |
| Strøm - Maks: | 660W |
| emballasje: | Bulk |
| Pakke / tilfelle: | TO-247-3 |
| Andre navn: | Q2675300 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | IXGX120N60B |
| Inngangstype: | Standard |
| IGBT Type: | PT |
| Gate Charge: | 350nC |
| Utvidet beskrivelse: | IGBT PT 600V 200A 660W Through Hole PLUS247™-3 |
| Beskrivelse: | IGBT 600V 200A 660W TO247 |
| Nåværende - Samlerpulserte (Icm): | 300A |
| Nåværende - Samler (Ic) (Maks): | 200A |
| Email: | [email protected] |
Beslektede deler til IXGX120N60B
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
IXGX120N60B3 | IXYS | IGBT 600V 280A 780W PLUS247 | Forespørsel |
|
IXGX120N120B3 | IXYS | IGBT 1200V 200A 830W PLUS247 | Forespørsel |
|
IXGX120N60C2 | IXYS | IGBT 600V 75A 830W PLUS TO-247 | Forespørsel |
|
IXGX12N90C | IXYS | IGBT 900V 24A 100W PLUS247 | Forespørsel |
|
IXGX120N120A3 | IXYS | IGBT 1200V 240A 830W PLUS247 | Forespørsel |
|
IXGX120N60A3 | IXYS | IGBT 600V 200A 780W PLUS247 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog