Kjøpe IXGX120N60C2 med BYCHPS
Kjøp med garanti
IXGX120N60C2
- Delenummer:
- IXGX120N60C2
- Produsent:
- IXYS Corporation
- Beskrivelse:
- IGBT 600V 75A 830W PLUS TO-247
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17560 Pieces
- Dataark:
- IXGX120N60C2.pdf
Introduksjon
BYCHIPS er strømprodusenten for IXGX120N60C2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for IXGX120N60C2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.5V @ 15V, 100A |
| Testtilstand: | 400V, 80A, 1 Ohm, 15V |
| Td (på / av) @ 25 ° C: | 40ns/120ns |
| Bytte energi: | 1.7mJ (on), 1mJ (off) |
| Leverandør Enhetspakke: | PLUS247™-3 |
| Serie: | HiPerFAST™, Lightspeed™ |
| Strøm - Maks: | 830W |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-247-3 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | IXGX120N60C2 |
| Inngangstype: | Standard |
| IGBT Type: | - |
| Gate Charge: | 370nC |
| Utvidet beskrivelse: | IGBT 600V 75A 830W Through Hole PLUS247™-3 |
| Beskrivelse: | IGBT 600V 75A 830W PLUS TO-247 |
| Nåværende - Samlerpulserte (Icm): | 500A |
| Nåværende - Samler (Ic) (Maks): | 75A |
| Email: | [email protected] |
Beslektede deler til IXGX120N60C2
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
IXGX120N60B | IXYS | IGBT 600V 200A 660W TO247 | Forespørsel |
|
IXGX120N60A3 | IXYS | IGBT 600V 200A 780W PLUS247 | Forespørsel |
|
IXGX120N120B3 | IXYS | IGBT 1200V 200A 830W PLUS247 | Forespørsel |
|
IXGX120N60B3 | IXYS | IGBT 600V 280A 780W PLUS247 | Forespørsel |
|
IXGX12N90C | IXYS | IGBT 900V 24A 100W PLUS247 | Forespørsel |
|
IXGX100N160A | IXYS | IGBT TO247 | Forespørsel |
|
IXGX120N120A3 | IXYS | IGBT 1200V 240A 830W PLUS247 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers