Kjøpe LFB180100-000 med BYCHPS
Kjøp med garanti
LFB180100-000
- Delenummer:
- LFB180100-000
- Beskrivelse:
- FERRITE CORE 29 OHM SOLID 10MM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13987 Pieces
Introduksjon
BYCHIPS er strømprodusenten for LFB180100-000, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LFB180100-000 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Round |
|---|---|
| Serie: | LF |
| rangeringer: | - |
| Ytre dimensjon: | 0.713" Dia (18.10mm) |
| Andre navn: | 240-2283 LFB180100000 |
| Monteringstype: | Free Hanging |
| Materiale: | LF |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | LFB180100-000 |
| Lengde: | 0.394" (10.00mm) |
| Innvendig dimensjon: | 0.394" Dia (10.00mm) |
| Impedans @ Frekvens: | 29 Ohm @ 5MHz |
| Utvidet beskrivelse: | Solid Free Hanging Ferrite Core 29 Ohm @ 5MHz ID 0.394" Dia (10.00mm) OD 0.713" Dia (18.10mm) Length 0.394" (10.00mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 29 OHM SOLID 10MM |
| Email: | [email protected] |
Beslektede deler til LFB180100-000
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
782013046250 | Wurth Electronics Inc. | FERRITE CORE 255 OHM SOLID 5MM | Forespørsel |
 |
ZCAT2017-0930B-BK | TDK Corporation | FERRITE CORE 50 OHM HINGED 9MM | Forespørsel |
 |
LFB187102-000 | Laird-Signal Integrity Products | FERRITE CORE 84 OHM SOLID | Forespørsel |
 |
BF1125-3 | API Delevan Inc. | FERRITE CORE 191 OHM HINGED | Forespørsel |
 |
7427002 | Wurth Electronics Inc. | FERRITE CORE 125 OHM SOLID 1.2MM | Forespørsel |
 |
74270091 | Wurth Electronics Inc. | FERRITE CORE 170 OHM SOLID 9.5MM | Forespørsel |
 |
74270001 | Wurth Electronics Inc. | FERRITE CORE 52 OHM SOLID 0.76MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog