Kjøpe MKI75-12E8 med BYCHPS
Kjøp med garanti
MKI75-12E8
- Delenummer:
- MKI75-12E8
- Produsent:
- IXYS Corporation
- Beskrivelse:
- MOD IGBT H-BRIDGE 1200V 130A E3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17037 Pieces
- Dataark:
- MKI75-12E8.pdf
Introduksjon
BYCHIPS er strømprodusenten for MKI75-12E8, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MKI75-12E8 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 1200V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.5V @ 15V, 75A |
| Leverandør Enhetspakke: | E3 |
| Serie: | - |
| Strøm - Maks: | 500W |
| Pakke / tilfelle: | E3 |
| Driftstemperatur: | -40°C ~ 125°C (TJ) |
| NTC-termistor: | No |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MKI75-12E8 |
| Input Kapasitans (Cies) @ Vce: | 5.7nF @ 25V |
| Input: | Standard |
| IGBT Type: | NPT |
| Utvidet beskrivelse: | IGBT Module NPT Full Bridge Inverter 1200V 130A 500W Chassis Mount E3 |
| Beskrivelse: | MOD IGBT H-BRIDGE 1200V 130A E3 |
| Gjeldende - Samler Cutoff (Maks): | 1.1mA |
| Nåværende - Samler (Ic) (Maks): | 130A |
| konfigurasjon: | Full Bridge Inverter |
| Email: | [email protected] |
Beslektede deler til MKI75-12E8
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
APTGF150SK120TG | Microsemi Corporation | IGBT 1200V 200A 961W SP4 | Forespørsel |
 |
MWI60-06G6K | IXYS | MOD IGBT SIX-PACK RBSOA E1 | Forespørsel |
|
APTGT100H170G | Microsemi Corporation | IGBT MOD TRENCH FULL BRIDGE SP6 | Forespørsel |
|
MKI75-06A7T | IXYS | IGBT H-BRIDGE 600V E2PACK | Forespørsel |
|
MKI75-06A7 | IXYS | MOD IGBT H-BRIDGE 600V 90A E2 | Forespørsel |
 |
CM400HA-34H | Powerex Inc. | IGBT MOD SGL 1700V 400A H SER | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers