Kjøpe SCMR22C155MSBA0 med BYCHPS
Kjøp med garanti
SCMR22C155MSBA0
- Delenummer:
- SCMR22C155MSBA0
- Produsent:
- AVX Corporation
- Beskrivelse:
- CAPACITOR 1.5F 20% 5V THRU HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15093 Pieces
- Dataark:
- SCMR22C155MSBA0.pdf
Introduksjon
BYCHIPS er strømprodusenten for SCMR22C155MSBA0, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SCMR22C155MSBA0 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 5V |
|---|---|
| Toleranse: | ±20% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 0.709" L x 0.354" W (18.00mm x 9.00mm) |
| Serie: | SMC |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 478-10014 |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 3 Weeks |
| Produsentens varenummer: | SCMR22C155MSBA0 |
| Levetid @ Temp.: | 1000 Hrs @ 65°C |
| Lead Spacing: | 0.453" (11.50mm) |
| Høyde - sittende (maks): | 1.004" (25.50mm) |
| Utvidet beskrivelse: | 1.5F ±20%(EDLC) Supercapacitor 5V Radial, Can 120 mOhm @ 1MHz 1000 Hrs @ 65°C |
| ESR (ekvivalent serieresistens): | 120 mOhm @ 1MHz |
| Beskrivelse: | CAPACITOR 1.5F 20% 5V THRU HOLE |
| kapasitans: | 1.5F |
| Email: | [email protected] |
Beslektede deler til SCMR22C155MSBA0
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SCMR22C155MRBA0 | AVX Corporation | CAPACITOR 1.5F 20% 5V THRU HOLE | Forespørsel |
 |
EEC-F5R5H105 | Panasonic Electronic Components | CAP 1F -20% +80% 5.5V T/H | Forespørsel |
 |
MAL219690103E3 | Vishay BC Components | CAP ALUM 90F 2.8V SNAP | Forespørsel |
 |
JUC0E335MPD | Nichicon | CAP 3.3F 20% 2.5V THROUGH HOLE | Forespørsel |
 |
EEC-S0HD473H | Panasonic Electronic Components | CAP 47MF -20% +80% 5.5V T/H | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers