Kjøpe W83L603G med BYCHPS
Kjøp med garanti
W83L603G
- Delenummer:
- W83L603G
- Produsent:
- Nuvoton Technology Corporation America
- Beskrivelse:
- IC I/O EXPANDER SMBUS 8B 14SOIC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14300 Pieces
- Dataark:
- W83L603G.pdf
Introduksjon
BYCHIPS er strømprodusenten for W83L603G, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for W83L603G via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3.3V |
|---|---|
| Leverandør Enhetspakke: | 14-SOP |
| Serie: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | 14-SOIC (0.154", 3.90mm Width) |
| Utgangstype: | Open Drain, Push-Pull |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall I / O: | 8 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | W83L603G |
| Avbryt Output: | Yes |
| Interface: | SMBus |
| Egenskaper: | Buzzer Outputs, LED Outputs, POR |
| Utvidet beskrivelse: | I/O Expander 8 SMBus 14-SOP |
| Beskrivelse: | IC I/O EXPANDER SMBUS 8B 14SOIC |
| Nåværende - Utgangskilde / Sink: | 16mA |
| Email: | [email protected] |
Beslektede deler til W83L603G
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
PCA9539PWRG4 | Texas Instruments | IC I/O EXPANDER I2C 16B 24TSSOP | Forespørsel |
 |
PCAL6416AEXX | NXP USA Inc. | IC GPIO EXPANDER 16BIT 24XFBGA | Forespørsel |
 |
W83L604G | Nuvoton Technology Corporation of America | IC I/O EXPANDER SMBUS 14B 20SSOP | Forespørsel |
 |
SX1511BIULTRT | Semtech Corporation | IC GPIO EXPANDER I2C 8CH 20QFN | Forespørsel |
|
PCA9674PW,112 | NXP USA Inc. | IC I/O EXPANDER I2C 8B 16TSSOP | Forespørsel |
|
PCA9534PWRG4 | Texas Instruments | IC I/O EXPANDER I2C 8B 16TSSOP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers