Kjøpe AISC-1206-R10J-T med BYCHPS
Kjøp med garanti
AISC-1206-R10J-T
- Delenummer:
- AISC-1206-R10J-T
- Produsent:
- Abracon Corporation
- Beskrivelse:
- FIXED IND 100NH 850MA 300 MOHM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12170 Pieces
Introduksjon
BYCHIPS er strømprodusenten for AISC-1206-R10J-T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for AISC-1206-R10J-T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±5% |
| Leverandør Enhetspakke: | - |
| Størrelse / Dimensjon: | 0.140" L x 0.085" W (3.56mm x 2.16mm) |
| skjerming: | Unshielded |
| Serie: | AISC-1206 |
| rangeringer: | - |
| Q @ Freq: | 55 @ 300MHz |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Nonstandard |
| Andre navn: | 535-12417-2 |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ceramic |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | AISC-1206-R10J-T |
| induktans: | 100nH |
| Høyde - sittende (maks): | 0.060" (1.52mm) |
| Frekvens - Test: | 100MHz |
| Frekvens - Selvresonans: | 1.1GHz |
| Utvidet beskrivelse: | 100nH Unshielded Wirewound Inductor 850mA 300 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 100NH 850MA 300 MOHM |
| DC-motstand (DCR): | 300 mOhm Max |
| Nåværende vurdering: | 850mA |
| Nåværende - Metning: | - |
| Email: | [email protected] |
Beslektede deler til AISC-1206-R10J-T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers